? semiconductor components industries, llc, 2009 september, 2016 ? rev. 2 1 publication order number: mc74hct132a/d mc74hct132a quad 2-input nand gate with schmitt-trigger inputs with lsttl compatible inputs high?performance silicon?gate cmos the mc74hct132a is identical in pinout to the ls132. the device inputs are compatible with standard cmos outputs; with pull?up resistors, they are compatible with lsttl outputs. the mc74hct132a can be used to enhance noise immunity or to square up slowly changing waveforms. features ? output drive capability: 10 lsttl loads ? outputs directly interface to cmos, nmos, and ttl ? operating voltage range: 2.0 to 6.0 v ? low input current: 1.0 a ? high noise immunity characteristic of cmos devices ? in compliance with the requirements as defined by jedec standard no. 7a ? chip complexity: 72 fets or 18 equivalent gates ? nlv prefix for automotive and other applications requiring unique site and control change requirements; aec?q100 qualified and ppap capable ? these devices are pb?free, halogen free/bfr free and are rohs compliant figure 1. pin assignment 11 12 13 14 8 9 10 5 4 3 2 1 7 6 b3 y4 a4 b4 v cc y3 a3 a2 y1 b1 a1 gnd y2 b2 marking diagrams a = assembly location wl, l = wafer lot y = year ww, w = work week g or = pb?free package soic?14 d suffix case 751a hct132ag awlyww tssop?14 dt suffix case 948g hct 132a alyw 1 14 see detailed ordering and shipping information in the package dimensions section on page 2 of this data sheet. ordering information inputs output aby llh lhh hlh hhl function table 1 14 www. onsemi.com (note: microdot may be in either location)
mc74hct132a www. onsemi.com 2 figure 2. logic diagram a1 b1 y1 3 2 1 pin 14 = v cc pin 7 = gnd y = ab a2 b2 y2 6 5 4 a3 b3 y3 8 10 9 a4 b4 y4 11 13 12 ordering information device package shipping ? mc74hct132adg soic?14 (pb?free) 55 units / rail mc74hct132adr2g 2500 / tape & reel NLV74HCT132ADR2G* 2500 / tape & reel mc74hct132adtr2g tssop?14 (pb?free) 2500 / tape & reel nlvhct132adtr2g* 2500 / tape & reel ?for information on tape and reel specifications, including part orientation and tape sizes, please refer to our tape and reel packaging specifications brochure, brd8011/d. *nlv prefix for automotive and other applications requiring unique site and control change requirements; aec?q100 qualified and ppap capable.
mc74hct132a www. onsemi.com 3 maximum ratings symbol parameter value unit v cc positive dc supply voltage 0.5 to 7.0 v v in digital input voltage 0.5 to 7.0 v v out dc output voltage output in 3?state high or low state 0.5 to 7.0 0.5 to v cc 0.5 v i ik input diode current 20 ma i ok output diode current 20 ma i out dc output current, per pin 25 ma i cc dc supply current, v cc and gnd pins 75 ma i gnd dc ground current per ground pin 75 ma t stg storage temperature range 65 to 150 c t l lead temperature, 1 mm from case for 10 seconds 260 c t j junction temperature under bias 150 c ja thermal resistance 14?soic 14?tssop 125 170 c/w p d power dissipation in still air at 85 c soic tssop 500 450 mw msl moisture sensitivity level 1 f r flammability rating oxygen index: 30% ? 35% ul 94 v0 @ 0.125 in v esd esd withstand voltage human body model (note 1) machine model (note 2) charged device model (note 3) 2000 100 500 v i latch?up latch?up performance above v cc and below gnd at 85 c (note 4) 300 ma stresses exceeding those listed in the maximum ratings table may damage the device. if any of these limits are exceeded, device function ality should not be assumed, damage may occur and reliability may be affected. 1. tested to eia/jesd22?a114?a. 2. tested to eia/jesd22?a115?a. 3. tested to jesd22?c101?a. 4. tested to eia/jesd78. recommended operating conditions symbol parameter min max unit v cc dc supply voltage (referenced to gnd) 2.0 6.0 v v in , v out dc input voltage, output voltage (referenced to gnd) 0 v cc v t a operating temperature, all package types 55 125 c t r , t f input rise and fall time (figure 3) ? no limit (note 5) ns functional operation above the stresses listed in the recommended operating ranges is not implied. extended exposure to stresse s beyond the recommended operating ranges limits may affect device reliability. 5. when v in 0.5 v cc , i cc >> quiescent current. 6. unused inputs may not be left open. all inputs must be tied to a high?logic voltage level or a low?logic input voltage level.
mc74hct132a www. onsemi.com 4 dc electrical characteristics (voltages referenced to gnd) v cc guaranteed limit symbol parameter test conditions v 55 c to 25 c 85 c 125 c unit v t+ max maximum positive?going input threshold voltage v out = 0.1 v |i out | 20 a 4.5 5.5 1.9 2.1 1.9 2.1 1.9 2.1 v v t+ min minimum positive?going input threshold voltage v out = 0.1 v |i out | 20 a 4.5 5.5 1.2 1.4 1.2 1.4 1.2 1.4 v v t? max maximum negative?going input threshold voltage v out = v cc ? 0.1 v |i out | 20 a 4.5 5.5 1.2 1.4 1.2 1.4 1.2 1.4 v v t? min minimum negative?going input threshold voltage v out = v cc ? 0.1 v |i out | 20 a 4.5 5.5 0.5 0.6 0.5 0.6 0.5 0.6 v v h min (note 7) minimum hysteresis voltage v out = 0.1 v or v cc ? 0.1 v |i out | 20 a 4.5 5.5 0.4 0.4 0.4 0.4 0.4 0.4 v v oh minimum high?level output voltage v in v t? min or v t+ max |i out | 20 a 4.5 5.5 4.4 5.4 4.4 5.4 4.4 5.4 v v in ?v t? min or v t+ max |i out | 4.0 ma 4.5 3.98 3.84 3.7 v ol maximum low?level output voltage v in v t+ max |i out | 20 a 4.5 5.5 0.1 0.1 0.1 0.1 0.1 0.1 v v in v t+ max |i out | 4.0 ma 4.5 0.26 0.33 0.4 i in maximum input leakage current v in = v cc or gnd 5.5 0.1 1.0 1.0 a i cc maximum quiescent supply current (per package) v in = v cc or gnd i out = 0 a 5.5 1.0 10 40 a product parametric performance is indicated in the electrical characteristics for the listed test conditions, unless otherwise noted. product performance may not be indicated by the electrical characteristics if operated under different conditions. 7. v h min (v t+ min) (v t? max); v h max = (v t+ max) (v t? min). ac electrical characteristics (c l = 50 pf, input t r = t f = 6.0 ns, v cc = 5.0 v 10%) v cc guaranteed limit symbol parameter v 55 c to 25 c 85 c 125 c unit t plh , t phl maximum propagation delay, input a or b to output y (figures 3 and 4) 5.0 25 31 38 ns t tlh , t thl maximum output transition time, any output (figures 3 and 4) 5.0 15 19 22 ns c in maximum input capacitance ? 10 10 10 pf typical @ 25 c, v cc = 5.0 v c pd power dissipation capacitance (per gate) (note 8) 24 pf 8. used to determine the no?load dynamic power consumption: p d = c pd v cc 2 f + i cc v cc .
mc74hct132a www. onsemi.com 5 figure 3. switching waveforms t r v cc gnd 90% v m 10% 90% v m 10% input a or b ( v i ) y t phl t plh t thl t tlh *includes all probe and jig capacitance figure 4. test circuit c l * test point device under test output t f v i = gnd to 3.0 v v m = 1.3 v figure 5. typical schmitt?trigger applications (a)a schmitt trigger squares up inputs (a) with slow rise and fall times (b)a schmitt trigger offers maximum noise immunity v in v out v h v cc v t+ v t- gnd v oh v ol v in v h v out v cc v t+ v t- gnd v oh v ol v cc v in v out
mc74hct132a www. onsemi.com 6 package dimensions soic?14 nb case 751a?03 issue l notes: 1. dimensioning and tolerancing per asme y14.5m, 1994. 2. controlling dimension: millimeters. 3. dimension b does not include dambar protrusion. allowable protrusion shall be 0.13 total in excess of at maximum material condition. 4. dimensions d and e do not include mold protrusions. 5. maximum mold protrusion 0.15 per side. h 14 8 7 1 m 0.25 b m c h x 45 seating plane a1 a m s a m 0.25 b s c b 13x b a e d e detail a l a3 detail a dim min max min max inches millimeters d 8.55 8.75 0.337 0.344 e 3.80 4.00 0.150 0.157 a 1.35 1.75 0.054 0.068 b 0.35 0.49 0.014 0.019 l 0.40 1.25 0.016 0.049 e 1.27 bsc 0.050 bsc a3 0.19 0.25 0.008 0.010 a1 0.10 0.25 0.004 0.010 m 0 7 0 7 h 5.80 6.20 0.228 0.244 h 0.25 0.50 0.010 0.019 6.50 14x 0.58 14x 1.18 1.27 dimensions: millimeters 1 pitch soldering footprint* *for additional information on our pb?free strategy and soldering details, please download the on semiconductor soldering and mounting techniques reference manual, solderrm/d. 0.10
mc74hct132a www. onsemi.com 7 package dimensions tssop?14 wb case 948g issue c dim min max min max inches millimeters a 4.90 5.10 0.193 0.200 b 4.30 4.50 0.169 0.177 c ??? 1.20 ??? 0.047 d 0.05 0.15 0.002 0.006 f 0.50 0.75 0.020 0.030 g 0.65 bsc 0.026 bsc h 0.50 0.60 0.020 0.024 j 0.09 0.20 0.004 0.008 j1 0.09 0.16 0.004 0.006 k 0.19 0.30 0.007 0.012 k1 0.19 0.25 0.007 0.010 l 6.40 bsc 0.252 bsc m 0 8 0 8 notes: 1. dimensioning and tolerancing per ansi y14.5m, 1982. 2. controlling dimension: millimeter. 3. dimension a does not include mold flash, protrusions or gate burrs. mold flash or gate burrs shall not exceed 0.15 (0.006) per side. 4. dimension b does not include interlead flash or protrusion. interlead flash or protrusion shall not exceed 0.25 (0.010) per side. 5. dimension k does not include dambar protrusion. allowable dambar protrusion shall be 0.08 (0.003) total in excess of the k dimension at maximum material condition. 6. terminal numbers are shown for reference only. 7. dimension a and b are to be determined at datum plane ?w?. s u 0.15 (0.006) t 2x l/2 s u m 0.10 (0.004) v s t l ?u? seating plane 0.10 (0.004) ?t? ??? ??? ??? 0.25 (0.010) 8 14 7 1 pin 1 ident. h g a d c b s u 0.15 (0.006) t ?v? 14x ref k n n 7.06 14x 0.36 14x 1.26 0.65 dimensions: millimeters 1 pitch soldering footprint* *for additional information on our pb?free strategy and soldering details, please download the on semiconductor soldering and mounting techniques reference manual, solderrm/d.
mc74hct132a www. onsemi.com 8 on semiconductor and are trademarks of semiconductor components industries, llc dba on semiconductor or its subsidiaries i n the united states and/or other countries. on semiconductor owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property . a listing of on semiconductor?s product/patent coverage may be accessed at www.onsemi.com/site/pdf/patent?marking.pdf . on semiconductor reserves the right to make changes without further notice to any products herein. on semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does o n semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including wi thout limitation special, consequential or incidental damages. buyer is responsible for its products and applications using on semiconductor products, including compliance with all laws, reg ulations and safety requirements or standards, regardless of any support or applications information provided by on semiconductor. ?typical? parameters which may be provided in on semiconductor data sheets and/or specifications can and do vary in dif ferent applications and actual performance may vary over time. all operating parameters, including ?typic als? must be validated for each customer application by customer?s technical experts. on semiconductor does not convey any license under its patent rights nor the right s of others. on semiconductor products are not designed, intended, or authorized for use as a critical component in life support systems or any fda class 3 medical devices or medical devices with a same or similar classification in a foreign jurisdiction or any devices intended for implantation in the human body. should buyer purchase or use on semicondu ctor products for any such unintended or unauthorized application, buyer shall indemnify and hold on semiconductor and its officers, employees, subsidiaries, affiliates, and distrib utors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that on semiconductor was negligent regarding the design or manufacture of the part. on semiconductor is an equal opportunity/affirmative action employer. this literature is subject to all applicable copyright laws and is not for resale in any manner. p ublication ordering information n. american technical support : 800?282?9855 toll free usa/canada europe, middle east and africa technical support: phone: 421 33 790 2910 japan customer focus center phone: 81?3?5817?1050 mc74hct132a/d literature fulfillment : literature distribution center for on semiconductor 19521 e. 32nd pkwy, aurora, colorado 80011 usa phone : 303?675?2175 or 800?344?3860 toll free usa/canada fax : 303?675?2176 or 800?344?3867 toll free usa/canada email : orderlit@onsemi.com on semiconductor website : www.onsemi.com order literature : http://www.onsemi.com/orderlit for additional information, please contact your loc al sales representative ?
|
